Ipc4556 Pdf |link| -

Tape tests verify that the plating layers adhere firmly to the copper substrate without peeling.

plating for printed circuit boards. Released in January 2013, it provides specifications to ensure high reliability for solder joints, wire bonding (gold, aluminum, and copper), and contact resistance. Core Layer Thickness Requirements ipc4556 pdf

Protects the underlying palladium from oxidation, ensuring long-term solderability and clean contact surfaces. Key Benefits of Following IPC-4556 Tape tests verify that the plating layers adhere