One of the most common locations for a physical and thermal "hot spot" is an intersection where two separate cable circuits cross each other.According to Eaton's CYMCAP 3D Modeling documentation , traditional 2D equations fail when cables are not parallel. The 3D module simulates the exact intersection point where mutual heating is compounded, ensuring that overlapping thermal fields do not cook the cables from the outside in.
Modeling cables in multiple duct banks using the MDB module helps identify mutual heating effects that lead to localized overheating. cymcap hot crack
